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  2sj479(l), 2sj479(s) silicon p channel dv? mos fet high speed power switching ade-208-541 (z) 1st. edition sep. 1997 features low on-resistance r ds(on) = 25 m w typ. 4v gate drive devices. high speed switching outline 1. gate 2. drain 3. source 4. drain 1 2 3 4 1 2 3 4 ldpak g d s
2sj479(l), 2sj479(s) 2 absolute maximum ratings (ta = 25?) item symbol ratings unit drain to source voltage v dss ?0 v gate to source voltage v gss ?0 v drain current i d ?0 a drain peak current i d(pulse) note1 ?20 a body to drain diode reverse drain current i dr ?0 a channel dissipation pch note2 50 w channel temperature tch 150 ? storage temperature tstg ?5 to +150 ? notes: 1. pw 10 m s, duty cycle 1 % 2. value at tc = 25?
2sj479(l), 2sj479(s) 3 electrical characteristics (ta = 25?) item symbol min typ max unit test conditions drain to source breakdown voltage v (br)dss ?0 v i d = ?0ma, v gs = 0 gate to source breakdown voltage v (br)gss ?0 v i g = ?00 m a, v ds = 0 zero gate voltege drain current i dss ?0 m av ds = ?0 v, v gs = 0 gate to source leak current i gss ?0 m av gs = ?6v, v ds = 0 gate to source cutoff voltage v gs(off) ?.0 ?.0 v i d = ?ma, v ds = ?0v static drain to source on state r ds(on) 2535m w i d = ?5a, v gs = ?0v note3 resistance r ds(on) 4060m w i d = ?5a, v gs = ?v note3 forward transfer admittance |y fs | 1220 s i d = ?5a, v ds = ?0v note3 input capacitance ciss 1700 pf v ds = ?0v output capacitance coss 950 pf v gs = 0 reverse transfer capacitance crss 260 pf f = 1mhz turn-on delay time t d(on) 20 ns v gs = ?0v, i d = ?5a rise time t r 290 ns r l = 0.67 w turn-off delay time t d(off) 170 ns fall time t f 130 ns body to drain diode forward voltage v df ?.1 v i f = ?0a, v gs = 0 body to drain diode reverse recovery time t rr 70 ns i f = ?0a, v gs = 0 dif/ dt = 50a/? note: 3. pulse test see characteristic curves of 2sj471
2sj479(l), 2sj479(s) 4 main characteristics 100 75 50 25 0 50 100 150 200 ?00 ?00 ?00 ?0 ?0 ?0 ? ? ? ?.5 ?.1 ?.3 ? ? ?0 ?0 ?00 1 ms ta = 25 c 100 s pw = 10 ms (1shot) dc operation (tc = 25 c) 10 s channel dissipation pch (w) case temperature tc ( c) power vs. temperature derating drain to source voltage v (v) ds drain current i (a) d maximun safe operation area operation in this area is limited by r ds(on) 3 1 0.3 0.1 0.03 0.01 10 100 1 m 10 m 100 m 1 10 dm p pw t d = pw t ch ?c(t) = s (t) ? ch ?c ch ?c = 2.5 c/w, tc = 25 c q g q q tc = 25 c d = 1 0.5 0.2 0.1 0.05 0.02 0.01 1shot pulse pulse width pw (s) normalized transient thermal impedance vs. pulse width normalized transient thermao impedance s (t) g
2sj479(l), 2sj479(s) 5 vin monitor d.u.t. vin 10 v r l v = ?0 v dd tr td(on) vin 90% 90% 10% 10% vout td(off) vout monitor 50 w 90% 10% t f switching timen test circuit waveform
2sj479(l), 2sj479(s) 6 package dimensions hitachi code jedec eiaj mass (reference value) ldpak (l) 1.4 g 10.2 0.3 0.86 0.76 0.1 2.54 0.5 2.54 0.5 + 0.2 ?0.1 1.2 0.2 4.44 0.2 1.3 0.15 2.59 0.2 0.4 0.1 11.0 0.5 8.6 0.3 10.0 11.3 0.5 + 0.3 ?0.5 (1.4) 1.27 0.2 as of january, 2001 unit: mm
2sj479(l), 2sj479(s) 7 hitachi code jedec eiaj mass (reference value) ldpak (s)-(1) 1.3 g 10.2 0.3 1.27 0.2 (1.5) (1.4) 8.6 0.3 10.0 + 0.3 ?0.5 4.44 0.2 1.3 0.15 0.1 + 0.2 ?0.1 0.4 0.1 0.86 + 0.2 ?0.1 2.54 0.5 2.54 0.5 1.2 0.2 3.0 + 0.3 ?0.5 (1.5) 7.8 6.6 2.2 1.7 7.8 7.0 as of january, 2001 unit: mm
2sj479(l), 2sj479(s) 8 hitachi code jedec eiaj mass (reference value) ldpak (s)-(2) 1.35 g 10.2 0.3 1.27 0.2 (1.5) (1.4) 8.6 0.3 10.0 + 0.3 ?0.5 4.44 0.2 1.3 0.2 0.1 + 0.2 ?0.1 0.4 0.1 0.86 + 0.2 ?0.1 2.54 0.5 2.54 0.5 1.2 0.2 5.0 + 0.3 ?0.5 (1.5) 7.8 6.6 2.2 1.7 7.8 7.0 as of january, 2001 unit: mm
2sj479(l), 2sj479(s) 9 cautions 1. hitachi neither warrants nor grants licenses of any rights of hitachi? or any third party? patent, copyright, trademark, or other intellectual property rights for information contained in this document. hitachi bears no responsibility for problems that may arise with third party? rights, including intellectual property rights, in connection with use of the information contained in this document. 2. products and product specifications may be subject to change without notice. confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. hitachi makes every attempt to ensure that its products are of high quality and reliability. however, contact hitachi? sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. design your application so that the product is used within the ranges guaranteed by hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail- safes, so that the equipment incorporating hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the hitachi product. 5. this product is not designed to be radiation resistant. 6. no one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from hitachi. 7. contact hitachi? sales office for any questions regarding this document or hitachi semiconductor products. hitachi, ltd. semiconductor & integrated circuits. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan tel: tokyo (03) 3270-2111 fax: (03) 3270-5109 copyright ? hitachi, ltd., 2000. all rights reserved. printed in japan. hitachi asia ltd. hitachi tower 16 collyer quay #20-00, singapore 049318 tel : <65>-538-6533/538-8577 fax : <65>-538-6933/538-3877 url : http://www.hitachi.com.sg url northamerica : http://semiconductor.hitachi.com/ europe : http://www.hitachi-eu.com/hel/ecg asia : http://sicapac.hitachi-asia.com japan : http://www.hitachi.co.jp/sicd/indx.htm hitachi asia ltd. (taipei branch office) 4/f, no. 167, tun hwa north road, hung-kuo building, taipei (105), taiwan tel : <886>-(2)-2718-3666 fax : <886>-(2)-2718-8180 telex : 23222 has-tp url : http://www.hitachi.com.tw hitachi asia (hong kong) ltd. group iii (electronic components) 7/f., north tower, world finance centre, harbour city, canton road tsim sha tsui, kowloon, hong kong tel : <852>-(2)-735-9218 fax : <852>-(2)-730-0281 url : http://www.hitachi.com.hk hitachi europe ltd. electronic components group. whitebrook park lower cookham road maidenhead berkshire sl6 8ya, united kingdom tel: <44> (1628) 585000 fax: <44> (1628) 585160 hitachi europe gmbh electronic components group dornacher stra b e 3 d-85622 feldkirchen, munich germany tel: <49> (89) 9 9180-0 fax: <49> (89) 9 29 30 00 hitachi semiconductor (america) inc. 179 east tasman drive, san jose,ca 95134 tel: <1> (408) 433-1990 fax: <1>(408) 433-0223 for further information write to: colophon 2.0


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